Achieving large uniform tensile elasticity in microfabricated diamond
Journal
Science
Journal Volume
371
Journal Issue
6524
Start Page
76
End Page
78
ISSN
00368075
Date Issued
2021
Author(s)
Dang, Chaoqun
Dai, Bing
Chou, Chang-Ti
Yang, Yang
Fan, Rong
Lin, Weitong
Meng, Fanling
Hu, Alice
Zhu, Jiaqi
Han, Jiecai
Minor, Andrew M.
Li, Ju
Lu, Yang
Abstract
Diamond is not only the hardest material in nature, but is also an extreme electronic material with an ultrawide bandgap, exceptional carrier mobilities, and thermal conductivity. Straining diamond can push such extreme figures of merit for device applications. We microfabricated single-crystalline diamond bridge structures with ~1 micrometer length by ~100 nanometer width and achieved samplewide uniform elastic strains under uniaxial tensile loading along the [100], [101], and [111] directions at room temperature. We also demonstrated deep elastic straining of diamond microbridge arrays. The ultralarge, highly controllable elastic strains can fundamentally change the bulk band structures of diamond, including a substantial calculated bandgap reduction as much as ~2 electron volts. Our demonstration highlights the immense application potential of deep elastic strain engineering for photonics, electronics, and quantum information technologies. © 2021 American Association for the Advancement of Science. All rights reserved.
Publisher
American Association for the Advancement of Science
Type
journal article