子計畫三:超寬頻平面電路與轉接的最佳化設計(1/3)
Date Issued
2005
Date
2005
Author(s)
DOI
932219E002022
Abstract
In the first year, the project emphasizes at two
parts. One is the transition from microstrip (MS)
lines to the rectangular waveguide (RWG) and
the other is the bond-wire transition between
microstrip lines. For the MS to RWG transition,
the transition realized in the Q-band has a more
than 50% bandwidth in which the insertion loss
is better than 15dB. Compared with the
traditional MS to RWG transition, the bandwidth
is very large and the size of transition is small.
For the bond-wire transition, we proposed an
equivalent circuit for the transition and extracted
the equivalent circuit parameters in it. Based on
the extracted parameters, a wideband bond-wire
transition is designed and verified.
Subjects
microstrip
metallic waveguide
bondwire
interconnect
interconnect
transciever
Publisher
臺北市：國立臺灣大學電信工程學研究所
Type
report
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