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College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
Current collapse suppression in algan/gan hemts using silicon substrate removal technique
Details
Current collapse suppression in algan/gan hemts using silicon substrate removal technique
Journal
WiPDA Asia 2019 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Date Issued
2019
Author(s)
Chen, Y.-T.
JIAN-JANG HUANG
DOI
10.1109/WiPDAAsia.2019.8760325
URI
https://www.scopus.com/inward/record.url?eid=2-s2.0-85070339022&partnerID=40&md5=97ab327f20abbaaa52a420589ca0e6a2
https://scholars.lib.ntu.edu.tw/handle/123456789/559031
Type
conference paper
