In-situ observation of the void formation-and propagation mechanism in solder joints under current-stressing
Resource
Acta Materialia,53(7),2029-2035.
Journal
Acta Materialia
Journal Volume
53
Journal Issue
7
Pages
2029-2035
Date Issued
2005-04
Date
2005-04
Author(s)
Lin, Y. H.
Hu, Y. C.
Tsai, C. M.
Kao, C. R.
Tu, and K. N.
Type
journal article