Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering process

Journal

Journal of Electronic Materials

Journal Volume

42

Journal Issue

6

Pages

1254-1259

Date Issued

2013

Author(s)

Chung C.K.

Chen Y.J.

Yang T.L.

DOI

10.1007/s11664-013-2582-3

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84877750407&doi=10.1007%2fs11664-013-2582-3&partnerID=40&md5=0218fd05e8e837b04ecd6aa593fb4c97

https://scholars.lib.ntu.edu.tw/handle/123456789/432629

Type

journal article