Reduction in reflections and ground bounce for signal line through a split power plane by using differential coupled microstrip lines
Journal
Electrical Performance of Electronic Packaging
Pages
107-110
Date Issued
2003
Author(s)
Shiue, Guang-Hwa
Abstract
The signal propagating along a microstrip line over a slot on the power plane will suffer from composite effects of reflected noise by a discontinuity in signal return path and ground bounce between power/ground planes. The paper investigates the noise reduction by using differential signaling. A efficient 2D FDTD method together with equivalent circuits for the differential line and the slot is established and simulations are performed for a three-layer structure to characterize ground bounce coupling. © 2003 IEEE.
Other Subjects
Electronics packaging; Equivalent circuits; Finite difference time domain method; 2-D FDTD method; Coupled microstrip lines; Differential lines; Differential signaling; Ground bounce; Return paths; Signal lines; Three-layer structures; Microstrip lines
Type
journal article
File(s)![Thumbnail Image]()
Loading...
Name
01250010.pdf
Size
193.66 KB
Format
Adobe PDF
Checksum
(MD5):4c710661fd641cd877c3b8d52e179b47