reilability of flip-chip package
Date Issued
2006
Date
2006
Author(s)
Tsai, Kun-Ru
DOI
zh-TW
Abstract
In study the reliability of electronic packages from mechanics point of view, the analytical of stress and strain obtained from finite element analysis and fatigue life prediction based on a Coffin-Manson equation are always constant values. However, the real outcomes of package life have probability distributions and frequently plotted in Weibull probability papers. In order to find out this contradiction, we suppose two kind of possible causes to investigate. One is the geometric parameters of a flip-chip package are random variables. The other is parameters of the Coffin-Manson equation are also random variables. The method of investigation is using finite element software to simulate a flip-chip package on thermal-cyclic loading. Then the cyclic equivalent inelastic strain range of a certain type of flip-chip package is found, and the fatigue life of the package is determined base on a Coffin-Manson equation. It is found that among different geometric parameters, the radius of solder bump affects the fatigue life of the package the most when considering the actually manufacturing tolerance. Considering parameters of the Coffin-Manson equation are random variables, we found the exponent parameter affects the fatigue life distribution more than the other parameter.
Subjects
覆晶構裝體
可靠度
隨機疲勞壽命分配
electronic package
random variable
probability distribution
reliability
Type
thesis
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