Molecular dynamics study of copper trench filling in damascene process

Resource

Materials Science in Semiconductor Processing 8 (5): 587-601

Journal

Materials Science in Semiconductor Processing

Journal Volume

8

Journal Issue

5

Pages

587-601

Date Issued

2005

Date

2005

Author(s)

Hong, R.T.

Huang, M.J.

Yang, J.Y.

URI

http://ntur.lib.ntu.edu.tw//handle/246246/106770

File(s)

Name

15.pdf

Size

3.32 MB

Format

Adobe PDF

Checksum

(MD5):3acd48cf4566a168810fe300882f9639