Thermal-driven analog placement considering device matching

Journal

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Journal Volume

30

Journal Issue

3

Pages

325-336

Date Issued

2011

Author(s)

Lin, M.P.-H.

Zhang, H.

Wong, M.D.F.

DOI

10.1109/TCAD.2010.2097308

URI

http://www.scopus.com/inward/record.url?eid=2-s2.0-79951901420&partnerID=MN8TOARS

http://scholars.lib.ntu.edu.tw/handle/123456789/365144

Type

journal article