Skip to main content
English
中文
Log In
Log in
Log in with ORCID
NTU Single Sign On
Have you forgotten your password?
Home
College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
FF-bond: Multi-bit flip-flop bonding at placement
Details
FF-bond: Multi-bit flip-flop bonding at placement
Journal
Proceedings of the International Symposium on Physical Design
Pages
147-153
Date Issued
2013
Author(s)
Tsai, C.-C.
Shi, Y.
Luo, G.
HUI-RU JIANG
DOI
10.1145/2451916.2451955
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/497943
URL
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84875825605&doi=10.1145%2f2451916.2451955&partnerID=40&md5=d5b521f914d4c7c84052cb8b58ef2c46
SDGs
[SDGs]SDG11
Type
conference paper
