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  4. 改善鋁箔蝕孔密度與均勻性之電源波形設計
 
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改善鋁箔蝕孔密度與均勻性之電源波形設計

Date Issued
2005
Date
2005
Author(s)
林招松  
DOI
932216E002020
URI
http://ntur.lib.ntu.edu.tw//handle/246246/12493
Abstract
The effects of current waveforms and sulfate ions on pitting behavior of aluminum foils for low-voltage electrolytic capacitor were investigated during etching in hydrochloric acid. During the course of etching, the galvanodynamic polarization curve was recorded, in which the breakdown potential was measured. A scanning electron microscope was employed for characterizing the surface morphology and cross section of the foil, including the average depth and linear density of the pits. Cross-sectional transmission electron microscope specimens were prepared from the as-etched foil to reveal the detailed pit morphology and etch film structure. Finally, X-ray photoelectron spectra of the surface film on the as-etched foil were measured using an ESCA250 (VG Science Inc., UK) spectrometer with monochromatic Mg K radiation.  Experimental results indicate that compared with the triangular and sinusoidal waveforms, etching with the square current waveform resulted in larger and deeper pits, thicker etch films, and more weight lost during etching. This is due to the more charge imposed in each anodic half-cycle associated with the square waveform. The presence of sulfate ions in hydrochloric acid led to the formation of finer, uniformly-distributed and shallower pits; thereby, reducing the loss of aluminum due to undermining by the cubic pits. The effect of sulfate ions on the pitting behavior was presumably due to competitive adsorption of sulfate ions with chloride ions, as shown by XPS analysis.
Subjects
galvanodynamic polarization curve
X-ray photoelectron spectra
competitive adsorption
aluminum foils for low-voltage electrolytic capacitor
Publisher
臺北市:國立臺灣大學材料科學與工程學系暨研究所
Type
report
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932216E002020.pdf

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