Intermetallic compounds formed at the interface between liquid indium and copper substrates

Resource

Journal of Electronic Materials 31 (5): 488-493

Journal

Journal of Electronic Materials

Journal Volume

31

Journal Issue

5

Pages

488-493

Date Issued

2002

Date

2002

Author(s)

Yu, C. L.

Wang, S. S.

Chuang, T. H.

URI

Type

journal article

File(s)

Name

70.pdf

Size

576.75 KB

Format

Adobe PDF

Checksum

(MD5):bc6fd5962d0aec0c52e02cbd4071387a