Transmission-Line Based Modeling for Conformal Shielding in Advanced System-in-Package (SiP)

Journal

Asia-Pacific Symp. Electromagn. Compat.

Pages

521-523

Date Issued

2015-05

Author(s)

C.-H. Chen

Y.-C. Tseng

I-C. Lin

C.-C. Fu

DOI

10.1109/apemc.2015.7175282

URI

http://scholars.lib.ntu.edu.tw/handle/123456789/394663

SDGs

[SDGs]SDG7

Type

conference paper