Advanced Liquid Cooling for 2.5D ICs: Integrated Top Diamond Heat Spreader with Embedded Liquid Channels
Journal
Proceedings of the 27th Electronics Packaging Technology Conference, EPTC 2025
Start Page
1
End Page
6
ISBN
[9798331561451]
Date Issued
2025-12-02
Author(s)
Abstract
As power densities of 2.5D ICs for HPC/AI applications continue to escalate, direct-to-chip cooling is critical. While passive heat spreaders offer benefits, they are reaching their limits in managing the extreme heat flux from next-generation GPUs. This paper demonstrates a novel thermal architecture that integrates active liquid cooling directly within a top-side diamond heat spreader. By mounting a diamond layer with embedded microfluidic channels directly onto a thinned GPU, our design achieves a junction-to-fluid thermal resistance (Rth) of 0.02°C/W under a 2000 W load. This represents a 50% reduction in total thermal resistance compared to an advanced baseline package using a passive diamond spreader. Systematic simulation reveals that an optimized geometry with a greater number of narrower channels effectively mitigates hotspot formation and lowers the maximum junction temperature (Tmax) to 61.6° C, confirming that integrating active cooling within the heat spreader provides a scalable and highly effective pathway to manage the thermal challenges of future ultra-high-power 2.5D ICs.
Event(s)
27th Electronics Packaging Technology Conference, EPTC 2025
Subjects
2.5D-IC Packaging
Diamond Heat Spreader
Direct-to-Chip Cooling
Embedded Channels
Thermal Management
Publisher
IEEE
Type
conference paper