Advancements in metrology for advanced semiconductor packaging
Journal
Proceedings of SPIE - The International Society for Optical Engineering
Journal Volume
12997
Start Page
129970R
ISBN (of the container)
9781510673120
ISBN
9781510673120
Date Issued
2024-06-18
Author(s)
DOI
10.1117/12.3024745
Abstract
In the wake of continuous miniaturization, optical metrology has solidified its role as an essential instrument in semiconductor manufacturing, chiefly due to its non-invasive, high-precision, and rapid measurement capacities. Particularly crucial in advanced techniques such as automated optical inspection (AOI), its significance grows with the rising demand for accurate 3D integrated circuit packaging characterization. This introduces notable challenges for optical metrology, which need addressing to meet rigorous in-line process demands. This talk aims to present an overview of key measurement methods in semiconductor fabrication, encompassing CD-SEM, X-ray or EUV scatterometry, reflectometry for optical critical dimension (OCD) metrology, AFM, advanced optics, and white light interferometry. The talk will share insights into the intrinsic limitations of these techniques, potential future innovations, and recent advancements in optical metrology. The session will conclude with a perspective on the evolution of these techniques amidst the prevailing technological constraints.
Event(s)
Optics and Photonics for Advanced Dimensional Metrology III 2024, Strasbourg, 9 April 2024 through 11 April 2024. Code 200976
Subjects
Advanced semiconductor packaging
AFM
automated optical inspection (AOI)
CD-SEM
optical critical dimension (OCD)
SDGs
Publisher
SPIE
Type
conference paper