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College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
Equivalent circuit of a through via in multi-layer environment
Details
Equivalent circuit of a through via in multi-layer environment
Journal
1992 Electrical Performance of Electronic Packaging
Pages
59-61
Date Issued
1992
Author(s)
Chang, K. K.
Kuo, C. N.
Wu, T. L.
Chen, W. L.
Wu, Ruey-Beei
DOI
10.1109/epep.1992.572265
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/299041
Type
conference paper