Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads

Resource

Journal of Electronic Materials 35 (1): 154-164

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

1

Pages

154-164

Date Issued

2006

Date

2006

Author(s)

Lin, Hsiu-Jen

URI

Type

journal article

File(s)

Name

93.pdf

Size

865.22 KB

Format

Adobe PDF

Checksum

(MD5):06d1f8ba6848d5ea98435a540a092578