Integration of a (–Cu–S–) n plane in a metal–organic framework affords high electrical conductivity
Journal
Nature Communications
Journal Volume
10
Journal Issue
1
Pages
1721
Date Issued
2019
Author(s)
Pathak, A.
Shen, J.-W.
Usman, M.
Wei, L.-F.
Mendiratta, S.
Chang, Y.-S.
Sainbileg, B.
Ngue, C.-M.
Chen, R.-S.
Luo, T.-T.
Chen, F.-R.
Chen, K.-H.
Tseng, T.-W.
Type
journal article