Electromigration in tin thin film

Journal

4th International Symposium on Electronic Materials and Packaging

Pages

463-467

ISBN

078037682X

9780780376823

Date Issued

2002

Author(s)

Hu Y.C.

Wan S.W.

DOI

10.1109/EMAP.2002.1188883

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84966605187&doi=10.1109%2fEMAP.2002.1188883&partnerID=40&md5=4bf87024f09f264e22023c32f4975455

https://scholars.lib.ntu.edu.tw/handle/123456789/432732

Publisher

Institute of Electrical and Electronics Engineers Inc.

Type

conference paper