Interactions between solder and metallization during long-term aging of advanced microelectronic packages

Resource

Journal of Electronic Materials,30(4),379-385.

Journal

Journal of Electronic Materials

Journal Volume

30

Journal Issue

4

Pages

379-385

Date Issued

2001-04

Date

2001-04

Author(s)

Ho, C. E.

Chen, W. T.

Kao, and C. R.

URI

http://ntur.lib.ntu.edu.tw//handle/246246/198858

Type

journal article