Inhibition of whisker growth on the surface of Sn-3Ag-0.5Cu-0.5Ce solder alloyed with Zn
Journal
Journal of Electronic Materials
Journal Volume
38
Journal Issue
3
Pages
420-424
Date Issued
2009
Author(s)
Abstract
Solder alloys doped with rare-earth elements have been reported to show many beneficial effects. However, tin whiskers have been observed to appear on the surface of Sn-3Ag-0.5Cu-0.5Ce solder joints after air exposure for short periods. Such a phenomenon of abnormal whisker growth may significantly degrade the reliability of electronic packaging. The present study shows that the tin whiskers can be prevented by the addition of 0.5 wt.% Zn into a Sn-3Ag-0.5Cu-0.5Ce solder. The inhibition effect on the whisker growth is correlated to the refining of (Ce 0.9Zn 0.1)Sn 3 intermetallics in this Sn-3Ag-0.5Cu-0.5Ce-0.5Zn alloy. © 2008 TMS.
Type
journal article