Inhibition of whisker growth on the surface of Sn-3Ag-0.5Cu-0.5Ce solder alloyed with Zn

Journal

Journal of Electronic Materials

Journal Volume

38

Journal Issue

3

Pages

420-424

Date Issued

2009

Author(s)

Chuang, T.-H.

Lin, H.-J.

TUNG-HAN CHUANG

DOI

10.1007/s11664-008-0606-1

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491996

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-59849122608&doi=10.1007%2fs11664-008-0606-1&partnerID=40&md5=1d5714b0828ffa24b61a62b3c62b3481

Type

journal article