Sn whisker mitigation by a thin metallic-glass underlayer in Cu-Sn
Journal
Applied Physics Letters
Journal Volume
103
Journal Issue
24
Date Issued
2013
Author(s)
Abstract
This study investigates the effects of thin film metallic glass (TFMG) as an underlayer on the Sn whisker mitigation in the Cu-Sn couples. Samples with and without TFMG underlayers were subjected to various heat treatments at elevated temperatures up to 85 ¢XC in monotonic and cyclic modes. TFMG underlayer effectively blocks the Cu/Sn interaction even with the thickness as thin as 25 nm. In addition, with very thin thickness, the introduction of TFMG underlayer is expected to yield insignificant degrees of compressive stress, which is anticipated to occur when the samples are exposed to thermal cycling. Their thin thickness and amorphous nature are considered beneficial to make TFMGs as a promising diffusion barrier for Sn whisker mitigation. ? 2013 AIP Publishing LLC.
Type
journal article