Packaging of High Frequency Silicon-Based Ultrasonic
Date Issued
2015
Date
2015
Author(s)
Chou, Pei-En
Abstract
This thesis includes two parts: (1) high frequency silicon-based ultrasonic nozzles and (2) atomizer’s holder. Our purpose is to improve the weak “handle” parts of the previous version of nozzles, to design the new 300 kHz atomizers, and to assemble them with the new holders’ package. The first part presents the design of analysis, simulation, and actually MEMS fabrication of 300kHz high frequency silicon-based ultrasonic nozzles. The new version of nozzles contains two parts: the piezoelectric driving part and the resonant part which is made of two cascaded nozzles. An one dimensional simplified model is analyzed first, and its equation of motion is worked out to obtain the contour of horn shape. Next, finite element analysis (FEM) 3-D simulation is used to calculate resonant frequencies of each part of 3D model of nozzle. All parts are first simulated individually, and then put together to simulate again. After several fine-tune adjustments, we get the final geometry of nozzles without unideal modes of vibration too near the working frequency, 300 kHz. Getting the physical modal of nozzle, the nozzle is then produced through a series of MEMS-based microfabrication process. The second part deals with the design, production, and assembling of 3D printing nozzle’s chunking appliance, the Holder. A three-layer-type structure of raft for 3D printing of acrylonitrile butadiene styrene is proposed to discuss how to reduce the thickness inhomogeneity resulted from thermal contraction, and a correction table of thermal contraction is mentioned. As for assembling part, we discuss the selection and usage of pins and screws, and finally all parts are assembled together.
Subjects
Ultrasonic
Nozzle
FEM
3D Printing
Holder
Raft
Thermal deformation
Type
thesis
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ntu-104-R02522513-1.pdf
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