Optimizing the wire-bonding parameters for second bond in ball grid array packages
Resource
Journal of the Chinese Institute of Engineers,23(5),625-632.
Journal
Journal of the Chinese Institute of Engineers
Journal Volume
23
Journal Issue
5
Pages
625-632
Date Issued
2000-09
Date
2000-09
Author(s)
Ho, C. E.
Chen, C.
Kao, and C. R.
Type
journal article