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College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
A Novel Method for In-Situ Monitoring of the Thickness of a Silicon Wafer during Wet Etching
Details
A Novel Method for In-Situ Monitoring of the Thickness of a Silicon Wafer during Wet Etching
Journal
Sensors and materials
Pages
P.0
Date Issued
2006
Author(s)
Lee, Chi-Yuan
Chang, Pei-Ze
Chen, Yung-Yu
Dai, Ching-Liang
Wang, X.-Y.
Chen, P.-H.
PING-HEI CHEN
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/584714
Type
journal article