Nonperiodic Flipped EBG for Dual-Band SSN Mitigation in Two-Layer PCB

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Journal Volume

9

Journal Issue

9

Pages

1690-1697

Date Issued

2019

Author(s)

Hsieh, H.-C.

Chan, H.-W.

Wang, Y.-C.

Lin, Y.-H.

Wang, W.-S.

Wang, S.-H.

DOI

10.1109/TCPMT.2019.2933490

URI

https://www.scopus.com/inward/record.url?eid=2-s2.0-85073803129&partnerID=40&md5=f45c6d18d0727972645abe0729fe8704

https://scholars.lib.ntu.edu.tw/handle/123456789/559157

Type

journal article