Nonperiodic Flipped EBG for Dual-Band SSN Mitigation in Two-Layer PCB
Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology
Journal Volume
9
Journal Issue
9
Pages
1690-1697
Date Issued
2019
Author(s)
Abstract
Several electromagnetic bandgap (EBG) structures have been designed to mitigate simultaneous switching noise (SSN) problems in dual bands in wireless local area networks (WLANs). In order to be applicable to two-layer printed circuit boards (PCBs), a novel flipped structure is introduced, which also creates slots for a wide stopband. This article proposes a 2 × 2 nonperiodic flipped-EBG (FEBG) for dual-band SSN mitigation in the WLAN, exhibiting noise suppression of 21 and 26 dB in 2.4-2.6 and 5-6 GHz bands, respectively. The simulation results are in good agreement with the experimental data. In addition, a method of positioning optimization is introduced as well to demonstrate the application of the FEBG on a two-layer PCB.
Type
journal article