Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni/Cu Pads
Resource
J. Electron. Mater,35(2),302-309.
Journal
J. Electron. Mater
Journal Volume
35
Journal Issue
2
Pages
302-309
Date Issued
2006-02
Date
2006-02
Author(s)
Chuang, T. H.
Yen, S. F.
Cheng, M. D.
Type
journal article