An Integrated Approach to Semiconductor Equipment Monitoring
Resource
Journal of The Chinese Society of Mechanical Engineering 19 (6): 581-591
Journal
Journal of The Chinese Society of Mechanical Engineering
Journal Volume
19
Journal Issue
6
Pages
581-591
Date Issued
1998
Date
1998
Author(s)
Abstract
In semiconductor fabrication processes, real-time equipment monitoring and fault detection become critical as most problems reveal themselves first on the equipment performance and much later on the wafer quality. The sooner we can detect the problem, the lower the production loss. The goal of this paper is to present an integrated semiconductor equipment monitoring approach. A semiconductor PECVD tool will be used as the study vehicle. The approach will include: (1) simultaneous monitoring scheme: a dartboard display of real-time data that provides an easy reading of the equipment's overall status, (2) system health index: an index that evaluates the equipment's overall health, and (3) statistical monitoring function: statistical charting function that integrates run-to-run SPC, real-time SPC, and other advanced SPC functions. The system has been implemented in tsmc FAB IV for testing. The preliminary results show that the proposed system is an effective tool for real-time monitoring and fault detection.
Other Subjects
Monitoring; Plasma enhanced chemical vapor deposition; Real time systems; Statistical process control; Semiconductor equipment monitoring; Semiconductor device manufacture
Type
journal article