Infrared Joining of TiAl Intermetallics Using Ti-15Cu-15Ni Foil, Part II: The Microstructure Evolution at High Temperature

Resource

Acta Materialia 46 (4): 1297-1305

Journal

Acta Materialia

Journal Volume

46

Journal Issue

4

Pages

1297-1305

Date Issued

1998

Date

1998

Author(s)

Lee, S.J.

Wu, S.K.

Lin, R.Y.

URI

Type

journal article

File(s)

Name

60.pdf

Size

1.06 MB

Format

Adobe PDF

Checksum

(MD5):245911cb1164ffe46a2b70be67db290c