Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Power Module Packaging
Journal
2023 International Conference on Electronics Packaging, ICEP 2023
ISBN
9784991191152
Date Issued
2023-01-01
Author(s)
Abstract
In this research, Ag, Cu, mixed Ag-In, and mixed Ag-SAC sinter pastes are used for large-area bonding in second-level power module packaging. Due to the large sintering area, different patterns with/without drying channels are tested in the pressure/pressureless sinter process. Besides, various bonding conditions, such as temperature and pressure, are investigated. To analyze large-area sintering effects, scanning acoustic microscopy is used to observe the interface of joints. Finally, the reliability of the large area sintered joints is assessed by thermal shock and bending tests. To conclude, this study explores the feasibility of multiple sintering pastes for large-area sintering. The results reveal that these pastes exhibit reliable properties under proper bonding conditions.
Subjects
Electronic packaging | Large-area sintering | Power module | Reliability tests | Sintered Ag/Cu pastes
Type
conference paper