Synthesis and Characterization of Novel Polyimide via Methylene Diphenyl Diisocyanate (MDI) and Their Nanocomposites
Date Issued
2016
Date
2016
Author(s)
Chang, Wei-Yao
Abstract
In this thesis, it is composed of two major parts: The first part is synthesis the kinds of polyimide by Methylene diphenyl diisocyanate (MDI). By adjust the molar ratio of Pyromellitic Dianhydride (PMDA), Trimellitic Anhydride (TMA), 4’4-Oxydianline (ODA), Bisphenol-A (BPA), and Diglycidyl Ether of Bisphenol A (DGEBA) to synthesis polyurea-imide (PUI), polyurea-amide-imide (PUAI), polyurea-imide-ester (PUIE), polyimide-epoxy (PIE), and polyamide-imide-epoxy (PAIE). The purpose of this study is using much cheaper materials to synthesis high thermal properties and low dielectric constant polymers. The thermal properties are measure by Thermal Gravimetric (TGA), Differential Scanning Calorimetry (DSC), and Thermomechanical Analysis (TMA); the morphologies of polymer/nano-clay are observed by Scanning Electronic Microscopy (SEM) and Transmission Electron Microscopy (TEM); and also measured the mechanical and electronic properties. The results of this study are shown that when imide groups are more, it will have good thermal and mechanical properties. The best polymer of this study is polyimide-epoxy (PIE), the degradation temperature is over 500 oC, and the dielectric constant is between 3.3-3.5. Therefore, polyimide-epoxy (PIE) polymer is much cheaper and also has higher performance as Kapton®. The second part is synthesis the new soluble polyimides which were synthesized from different 4,4''-diaminodiphenylmethane monomers with different alkyl substituents (4’4’-diamino-3,3’-dimethyl-diphenyl-methane, DDMDPM; 4,4’-methylene -bis(2-ethyl-6-methylaniline), MBEMA; and 4,4’-methylene-bis(2,6-diethylaniline), MBDEA)) in one-step with the poly(amic acid)s prepared from the polyaddition of 4,4’-oxydiphthalic anhydride (ODPA) and 4,4''-(Hexafluoroisopropylidene)diphthalic anhydride (6FDA). These polyimides exhibited excellent thermal stability, and they also possessed relatively low coefficients of thermal expansion and dielectric constants.
Subjects
Polyurea-imide (PUI)
Polyure-amide-imide (PAI)
Polyurea-imide-ester (PUIE)
Polyimde-epoxy (PIE)
Polyamide-imide-epoxy (PAIE)
Soluble Polyimide
Low-k Materials
Type
thesis
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