Study of cladding layer for photonic integrated circuits
Journal
Proceedings of SPIE - The International Society for Optical Engineering
Journal Volume
4603
Pages
218-223
Date Issued
2001
Author(s)
Abstract
Characterization results of cladding layer for photonic integrated circuits are present. The silicon oxide films were deposited by various methods. The mechanical stress, depending upon the methods of film deposition, had been measured. TEOS silicon oxide exhibited large mechanical stress. The stress of polymer benzocyclobutene (BCB) was also measured. Its stress is only 29 MPa. The roughness of BCB surface is 1.18 nm. The mode profiles of planar waveguide were calculated.
Type
conference paper