Design of wideband impedance matching for through-hole via transition using ellipse-shaped anti-pad
Journal
14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP
Pages
245-248
Date Issued
2006-10
Author(s)
Abstract
A systematic design procedure is derived to improve the electrical performance of multilayer through-hole via transition using high-impedance interconnects. In addition to thinner transmission line, a novel structure with ellipse-shaped anti-pad is proposed to achieve the better broadband matching condition. The compensation method also applies to a differential via transition successfully
SDGs
Type
conference paper