Robust Architectureand Physical CoDesign Environment (1/3)
Date Issued
2004-07-31
Date
2004-07-31
Author(s)
DOI
922218E002030
Abstract
Recent studies show that the nonuniform thermal distribu-
tion on the substrate and interconnects has impact on the
circuit reliability and performance. Hence three-dimensional
(3-D) thermal analysis is crucial to analyze these e®ects.
In this year, we develop an e±cient 3-D transient thermal
simulator based on the alternating direction implicit (ADI)
method for large scale temperature estimation problems.
Our simulator, 3D Thermal-ADI, not only has a linear run-
time and memory requirement, but also is unconditionally
stable. Detailed analysis of the 3-D nonhomogeneous cases
and boundary conditions for on-chip VLSI applications are
introduced and presented. Extensive experimental results
show that our algorithm is not only orders of magnitude
faster than the traditional thermal simulation algorithms,
but is also highly accurate and memory e±cient. The tem-
perature pro¯le of steady state can be reached in few itera-
tions. The software is avaiable on the web [1].
Publisher
臺北市：國立臺灣大學電子工程學研究所
Type
report
File(s)![Thumbnail Image]()
Loading...
Name
922218E002030.pdf
Size
380.59 KB
Format
Adobe PDF
Checksum
(MD5):e9c1a405c2a9147f7bf30bfdabceed02