Intermetallic Compounds formed during the Soldering Reactions of Eutectic Sn-9Zn with Cu and Ni Substrates
Resource
Zeitschrift fur Metallkunde 93: 95-98
Journal
Zeitschrift fur Metallkunde 93:
Pages
95-98
Date Issued
2002
Date
2002
Author(s)
Chan, Y. C.
Chiu, M. Y.
Chuang, T. H.
Type
journal article