Development of Gas-Assisted PDMS Mold Imprinting Process
Date Issued
2007
Date
2007
Author(s)
Cheng, Fang-Sung
DOI
zh-TW
Abstract
For conventional hot embossing, the substrate and the stamp are brought into contact and are compressed directly by the hot platen. The accuracy and area of replication are limited due to the inherent non-uniform pressure distribution. Si-wafers are too brittle to be used as embossing the molds with the conventional hot embossing operation. To enhance close contacting and uniform pressuring during large area and curved surface imprinting, PDMS mold and gas pressure are employed in this study.
This thesis probed into the research with regard to large area substrate imprinting, emphasized how to construct experiment machine applied on the gas-assisted hot imprinting and renovate 12 inch PDMS mold and explored the replication of 12 inch wafer imprinting. The next process is devoted to the development of PDMS mold UV-imprinting, the deformation of PDMS mold and curved substrate imprinting applied on optics components. The gasbag assisted imprinting system is developed and tested.
The results confirmed that replication patterns on 12-inch silicon wafer and 2-inch curved substrate in one imprint step using PDMS mold and gas pressure mechanism is demonstrated. With the hydrostatic pressure mechanism, the deformation of the PDMS mold is controlled. This study demonstrates that pattern replication on large/curved surface with low cost and simple process is feasible.
Subjects
氣體輔助壓印製程
液靜壓機構
PDMS模具
曲面壓印
大面積壓印
gas-assisted imprinting process
hydrostatic pressure mechanism
PDMS mold
curved imprinting
large area imprinting
Type
thesis
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