Application of Microcontact Printing to the Electroless Plating for the Fabrication of Microscale Metal Patterns
Date Issued
2005
Date
2005
Author(s)
Luo, Guo-Lung
DOI
zh-TW
Abstract
摘要
在印刷電路板產業中，使用化學電鍍沈積法進行銅導線製備，已廣泛被採用。本研究計畫擬在玻璃基材上運用微觸印刷技術製備化學鍍沈積法所需之種晶層，再進行化學鍍沈積法在玻璃基板上獲得微米級的金屬圖案，目前已可成功的使用化學電鍍沈積法製作線寬2微米的銅圖案和線寬0.8微米的銀圖案。未來希望能改善電鍍液和金屬鍍層的品質並進一步的縮小金屬導線的線寬。此外我們使用壓印與溶膠凝膠法製作可控制粗糙度的玻璃表面以探討粗糙度對化學電鍍銅層黏著性的影響。
ABSTRACT
Autocatalytic electroless copper plating is widely applied in the printed circuit board industry. In this study, the micro-contact printing technique is applied to directly fabricate the seeding layer for electroless deposition on glass substrate. Now, we can successfully fabricate copper pattern with feature size 10µm lines and separated by 10µm on glass substrate by micro - contact printing, and silver pattern with feature size 0.8µm lines and separated by 0.8µm on glass substrate. We also use the methods of soft embossing and sol-gel to fabricate glass substrate with specific roughness which could be controlled and discuss the relations between roughness of glass substrate and the adhesion of copper layer.
Subjects
化學鍍
微觸印刷
種晶層
壓印
溶膠凝膠法
microcontact printing
electroless deposition
seeding layer
masking layer
molding
sol- gel
Type
thesis
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