Design of a novel haptic device for bilateral teleoperations requiring accurate force interaction
Journal Volume
2019-July
Start Page
74
End Page
79
ISBN (of the container)
9781728124933
Date Issued
2019
Author(s)
Abstract
Haptic devices need to render accurate force to a human operator in order to create a virtual environment from a remote real environment. Existing end-effector type haptic devices employ parallel mechanisms to achieve force interaction in multiple degrees-of-freedom (DoF). Those parallel mechanisms have non-constant Jacobian matrices that create difficulties in the actuator and controller design for accurate haptic force interaction. This paper presents a 3-DoF translational parallel manipulator (TPM) with a constant Jacobian matrix to facilitate the force and impedance controller design. Instead of using external force sensors, series elastic actuators (SEAs) are used for the proposed device to realize the force rendering. SEAs can render more accurate output force and stiffness while the inertia and friction problems of using a gearhead can be ignored. In this paper, the modeling, design, and control of the haptic device are established to show the merits of the proposed TPM. Initial force control experiments demonstrate the accuracy and speed of SEA-based force control. We expect that this novel haptic device can serve as an alternative for robotic teleoperations requiring accurate force sensing and control.
Event(s)
2019 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2019
Subjects
Bilateral Teleoperation
Haptic Device
Impedance Control
Jacobian Matrix
Series Elastic Actuator
Translational Parallel Manipulator
Actuators
Degrees Of Freedom (mechanics)
Force Control
Intelligent Mechatronics
Jacobian Matrices
Manipulators
Mechanisms
Remote Control
Virtual Reality
Bilateral Teleoperation
Haptic Devices
Impedance Control
Series Elastic Actuators
Translational Parallel Manipulator
Controllers
SDGs
Publisher
Institute of Electrical and Electronics Engineers Inc.
Description
2019 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2019. Hong Kong. conference code:152854
Type
conference paper