Vertical hole transport through unipolar InGaN quantum wells and double heterostructures
Journal
Physical Review Materials
Journal Volume
6
Journal Issue
4
Date Issued
2022
Author(s)
Abstract
We report unipolar hole transport through unintentionally doped (UID) c-plane Ga-polar InGaN heterostructures to investigate the impact of alloy disorder on vertical transport. Simulations and experimental investigations were conducted on unipolar InGaN double heterostructures (DHs) and quantum well (QW) test structures by varying thicknesses and the number of QWs. The structures were simulated using one-dimensional (1D) and three-dimensional (3D) algorithms, incorporating the effects of random alloy disorder in the 3D model using the newly developed Localization Landscape theory. The electrical polarization discontinuity between GaN and InGaN results in a significant barrier for vertical carrier transport. Band-diagram and current density-voltage simulations indicate asymmetric polarization barriers to the vertical hole transport for the InGaN DHs. For the QW structures, however, the simulations indicate a symmetric barrier to the hole transport in forward and reverse bias. In the case of the InGaN DH layers, the 3D simulation results indicate a smaller barrier to hole transport compared to 1D simulations. For QW simulations, the barriers were found to be the same in both 1D and 3D simulations. The simulation results are experimentally verified using unipolar p-type vertical transport structures, enabled by n-to-p tunnel junctions to facilitate the current spreading within the bulk material for the mesa structures grown by ammonia-molecular beam epitaxy. The results indicate that increasing the UID In0.1Ga0.9N DH layer thickness from 15 to 30 nm increases the forward bias voltage drop (~2 V at 500A/cm2) more than the reverse bias voltage drop (~0.2 V at 500A/cm2). For the QW structures, increasing the number of QWs from one to three increases the voltage penalty similarly in forward and reverse directions (~0.25 V per QW at 500A/cm2). The results are beneficial in understanding the impact of alloy disorder on the transport properties of the III-nitride heterostructures. © 2022 American Physical Society.
Other Subjects
3D modeling; Ammonia; Bias voltage; Gallium nitride; Hole mobility; Molecular beam epitaxy; Polarization; Quantum chemistry; Semiconductor alloys; Semiconductor quantum wells; Three dimensional computer graphics; Tunnel junctions; 1-D simulation; 3D simulations; Alloy disorder; Double heterostructures; Heterostructure layers; Hole transports; Quantum well structures; Quantum-wells; Vertical transports; Voltage drop; III-V semiconductors
Type
journal article