Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints
Resource
Metallurgical and Materials Transactions A 38 (5): 1048-1055
Journal
Metallurgical and Materials Transactions A
Journal Volume
38
Journal Issue
5
Pages
1048-1055
Date Issued
2007
Date
2007
Author(s)
Abstract
The whisker growth in Sn-3Ag-0.5Cu-0.5Ce solder joints after storage at various temperatures is investigated. After reflow, cluster-shaped CeSn3 precipitates form in the solder matrix. It is much easier for the surface of the CeSn3 phases to oxidize than for the solder matrix. The oxidation of the outer surface of these CeSn3 precipitates is accompanied by rapid growth of tin whiskers. Storage temperature affects the morphology and growth kinetics of the whiskers, which are also correlated with the oxidation rates of the CeSn3 surface at various temperatures. The results showed that the driving force for the growth of tin whiskers in this Sn-3Ag-0.5Cu-0.5Ce solder is the compressive stress induced by the diffusion of oxygen into the CeSn3 precipitate clusters, which results in the lattice expansion in the oxidized CeSn3 phase. © The Minerals, Metals & Materials Society and ASM International 2007.
Other Subjects
Compressive stress; Crystal whiskers; Diffusion; Doping (additives); Morphology; Oxidation; Precipitates; Rare earth elements; Thermal effects; Tin alloys; Oxidation rates; Whisker growth; Soldered joints
Type
journal article
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