Morphological evolution induced by volume shrinkage in micro joints
Journal
2016 International Conference on Electronics Packaging
Pages
286-289
ISBN
9784904090176
Date Issued
2016
Author(s)
Yang H.W.
Abstract
In this study, sandwich structures of Ni/Sn/Ni was prepared by a general electroplating process. A high temperature storage test was conducted by isothermal aging at 180°C. Microstructure characterizations revealed that after 24 hours of heat treatment, the Sn solder consumed completely. Cross-sectional microstructure showed large voids was left among the IMC. The ratio of Voids is much beyond -11.3%, the theoretical volume shrinkage ratio induced by Ni/Sn interfacial reaction. In addition, the Ni 3 Sn 4 phase grew laterally and the ring-like morphology formed at the surface. We believe that surface diffusion contribute significantly in real micro joints and that such a microstructure would degrade its reliability.
SDGs
Publisher
Institute of Electrical and Electronics Engineers Inc.
Type
conference paper