Equipment condition diagnosis and fault fingerprint extraction in semiconductor manufacturing

Journal

2016 15th IEEE International Conference on Machine Learning and Applications

Pages

534-539

Date Issued

2017

Author(s)

Rostami, H.

Blue, J.

Yugma, C.

DOI

10.1109/ICMLA.2016.90

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/467304

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85015454213&doi=10.1109%2fICMLA.2016.90&partnerID=40&md5=0400f2bd9df3810ec093a26208f4ead5

Type

conference paper