Cu substion for Ni in Ti50Ni50-XPdX ( X=20∼30 at％) HTSMAs
Date Issued
2006
Date
2006
Author(s)
Chang, Han-Yun
DOI
zh-TW
Abstract
Transformation temperature and latent heat of Ti50(Ni, Cu)50-xPdx
（x：20 ~ 30 at％）high temperature shape memory alloys（SMAs）are
studied. In addition, annealing effect on transformation behavior and
microstructure of cold-rolled Ti50(Ni, Cu)50-xPdx SMAs is also studied.
Ti50(Ni25-yCuy)Pd25 and Ti50(Ni30-zCuz)Pd20 SMAs both exhibit one-stage
B2←→B19 transformation, and their Ms and ΔH increase with increasing
the Cu substitution. Severely cold-rolled and 650℃ annealed
Ti50(Ni15Cu15)Pd20 and Ti50(Ni15Cu10)Pd25 alloys induce precipitates in the
matrix. The precipitates increase their size with prolonging annealing time
and deteriorates the alloys’ shape memory effec（t SME）. The composition of
the precipitates is identified as (Ti,Cu)2(Pd,Ni) by EDX test. The precipitates
of 25％cold-rolled and 500℃annealed Ti50(Ni25Cu5)Pd20 are too small to be
observed in SEM. However, Ti50(Ni15Cu10)Pd25 and Ti50(Ni25Cu5)Pd20 SMAs
cold-rolled and annealed at 650℃ and 800℃, respectively, show no
precipitate and good SME. Among all Ti50(Ni, Cu)50-xPdx SMAs,
Ti50(Ni25Cu5)Pd20 SMA with 25％ cold rolling and 500℃×10min annealing
10 mins exhibits the best SME.
Subjects
記憶合金
Ti-Ni-Cu-Pd 四元合金
冷
軋延
再結晶
High temperature shape memory alloy
Ti-Ni-Cu-Pd alloys
Type
thesis
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