Phase formation and microstructure evolution in Cu/In/Cu joints

Journal

Microelectronics Reliability

Journal Volume

95

Pages

18-27

Date Issued

2019

Author(s)

Chiu Y.S.

Yu H.Y.

Hung H.T.

Wang Y.W.

DOI

10.1016/j.microrel.2019.02.004

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85062260728&doi=10.1016%2fj.microrel.2019.02.004&partnerID=40&md5=d71a9fe4f5142c0192f70554e3758d41

https://scholars.lib.ntu.edu.tw/handle/123456789/432566

Publisher

Elsevier Ltd

Type

journal article