Experimental Evidence for Formation of Ni-Al Compound in Flip-Chip Joints Under Current Stressing

Resource

Journal of ELECTRONIC MATERIALS, 40(10), 2076-2080

Journal

Journal of ELECTRONIC MATERIALS

Journal Volume

40

Journal Issue

10

Pages

2076-2080

Date Issued

2011

Date

2011

Author(s)

Tsai, M.Y.

Lin, Y.L.

Tsai, M.H.

Chen, Y.J.

DOI

URI

Type

journal article

File(s)

Name

132.pdf

Size

23.41 KB

Format

Adobe PDF

Checksum

(MD5):42394c927310aabd6f2605c1f1b4655c