An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packaging

Journal

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

Pages

243-246

Date Issued

2012

Author(s)

Tsai, H.-H.

Lee, J.-D.

Tsai, C.-H.

Wang, H.-C.

Chang, C.-C.

Chuang, T.-H.

DOI

URI

URL

Type

conference paper