Design of On-Chip Microwave Filters in Integrated Fan-Out Wafer Level Packaging (InFO-WLP) Technology

Journal

Asia-Pacific Int. Symp. Electronmagn. Compat.

Pages

246-248

Date Issued

2015-05

Author(s)

C.-K. Shen

M.-H. Tsai

H.-N. Chen

C.-P. Jou

Sally Liu

F.-L. Hsueh

DOI

10.1109/apemc.2015.7175404

URI

http://scholars.lib.ntu.edu.tw/handle/123456789/394660

Type

conference paper