Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu

Resource

Journal of Materials Research 21 (10): 2436-2439

Journal

Journal of Materials Research

Journal Volume

21

Journal Issue

10

Pages

2436-2439

Date Issued

2006

Date

2006

Author(s)

Yang, S.C.

Ho, C.E.

Chang, C.W.

Kao, C.R.

URI

Type

journal article

File(s)

Name

03.pdf

Size

2.2 MB

Format

Adobe PDF

Checksum

(MD5):ece385c6d70c81ee7904ebbdd3b9194f