Novel Method for In-Situ Monitoring of Thickness of Silicon Wafer during Wet Etching

Resource

Sensors and Materials 18 (2): 71-82

Journal

Sensors and Materials

Journal Volume

18

Journal Issue

2

Pages

71-82

Date Issued

2006-05

Date

2006-05

Author(s)

Lee, Chi-Yuan

Chen, Yung-Yu

Dai, Ching-Liang

Wang, Xuan-Yu

Chen, Ping-Hei

Lee, Shuo-Jen

URI

http://ntur.lib.ntu.edu.tw//handle/246246/106996