無鉛銲錫球格陣列構裝製程與可靠度分析─子計畫一：無鉛銲錫球格陣列構裝接點之冷熱循環與動態疲勞分析(III)
Date Issued
2003
Date
2003
Author(s)
DOI
912216E002037
Abstract
The purpose of this study is to build up
a complete reliability testing method for the
simulation of fatigue phenomenon during
the thermal cycling test in order to rapidly
evaluate the reliability of Pb-free solder
joints of BGA packages. Another effort of
this project is the electrical analysis of
packages to provide a direct information of
crack nucleation and propagation during
fatigue failure. In addition, the third year
program also involves the finite element
method to calculate the relation between the
deflection and maximal equivalent plastic
deformation. The fatigue life is obtained
using Coffin-Manson equation, which is
compared with the experimental results.
Subjects
reliability
fatigue
thermal cycling
Coffin-Manson.
Publisher
臺北市：國立臺灣大學材料科學與工程學研究所
Type
report
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Format
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